Exynos 2600 with Heat Pass Block Revealed: Samsung’s 2nm Chip Promises Breakthrough Cooling for Galaxy S26 Series

Samsung's upcoming Exynos 2600 chipset has made headlines this week with impressive benchmark results on Geekbench and 3DMark. But what’s really turning heads is a new innovation in thermal management: the Heat Pass Block (HPB).

What Is the Heat Pass Block?

According to reports from South Korea, Samsung has developed a Heat Pass Block (HPB) for the Exynos 2600—a new cooling layer designed to outperform traditional heat spreaders. Unlike standard heat spreaders added after chip assembly, the HPB is integrated within the chipset stack itself, sitting much closer to the application processor (AP).

This structure improves heat dissipation because the copper heat sink in the HPB is in direct proximity to the components generating the most heat—like the CPU, GPU, and NPU—allowing for more efficient thermal regulation.

Exynos 2600: Built for Performance & Efficiency

The Exynos 2600 will be manufactured using Samsung’s cutting-edge 2nm Gate-All-Around (GAA) process, which promises performance gains and power efficiency over previous generations. It is expected to debut with the Galaxy S26 series, launching in late January or early February 2026.

While the Galaxy S26 Ultra may still feature Qualcomm Snapdragon chips in some regions, the Exynos 2600 could power other Galaxy S26 models globally—similar to how the Galaxy Z Flip7 is reportedly using Exynos in all markets.

What's Next?

Samsung is currently in the quality testing phase for the Exynos 2600 and is expected to officially unveil the chip close to the Galaxy S26 launch window. If the Heat Pass Block delivers on its promise, the Exynos 2600 may mark a turning point for Samsung’s in-house silicon.