Huawei Breaks Boundaries: True 5nm Chip Without EUV, 3nm in Development for 2026

Huawei Developing True 5nm Chip Production Without EUV, 3nm R&D Underway

Huawei is pushing the boundaries of semiconductor manufacturing by developing a genuine 5nm chip production process—without relying on EUV lithography. According to a new report from UDN, Huawei aims to overcome its tech restrictions by using SSA800 lithography machines from Shanghai Micro Electronics (SMEE), leveraging multi-patterning techniques to bypass the need for EUV machines, which are patented by Dutch firm ASML and restricted from use in China.

Even more impressively, Huawei has already begun R&D for 3nm chips, following two parallel paths:

1. GAA (Gate-All-Around) architecture, similar to what industry giants like TSMC and Samsung use.

2. Carbon nanotube-based semiconductors, which have completed lab validation and are being adapted for SMIC's production lines.

Earlier this month, Huawei launched the MateBook Fold, powered by the Kirin X90. Though marketed as a "5nm chip," the Kirin X90 is actually a 7nm design enhanced by advanced packaging techniques, delivering performance comparable to 5nm chips. However, the chip’s yield rate stands at just 50%, significantly increasing production costs.

Huawei’s efforts mark a major step toward self-reliance in chip manufacturing and could redefine China’s position in the global semiconductor race.