Samsung Exynos 2500 Official: 3nm GAA Chipset with Ray Tracing, 59 TOPS NPU, and Support for Galaxy Z Flip7

Samsung has officially unveiled the Exynos 2500 — its most advanced mobile chipset yet — just in time for the debut of the Galaxy Z Flip7 on July 9. While it missed the Galaxy S25 series launch window, the Exynos 2500 is now in mass production and ready to power Samsung’s upcoming foldables.

Built on Samsung’s 3nm GAA (Gate-All-Around) node, the Exynos 2500 brings enhanced power efficiency, reduced thickness thanks to FOWLP packaging, and major gains in CPU, GPU, and AI performance.

Exynos 2500 CPU Breakdown:

10-core CPU (1+2+5+2 configuration)

1x Cortex-X925 @ 3.3GHz

2x Cortex-A725 @ 2.74GHz

5x Cortex-A725 @ 2.36GHz

2x Cortex-A520 @ 1.8GHz

15% faster big-core performance vs. Exynos 2400

GPU: Xclipse 950 with RDNA 3

Based on AMD’s RDNA 3 architecture

8 WGPs + 8 Render Backends (up from 6/4 on Exynos 2400)

Ray tracing hardware support

28% better FPS in ray-traced games

AI & NPU:

24K MAC design, up from 17K

59 TOPS performance, 39% more than previous-gen

Enables more on-device AI features and image enhancements

Camera & Video:

Support for up to 320MP sensors

AI-based Multi-layer Noise Reduction & Dynamic Range Compression

8K video recording at 30fps, 8K playback at 60fps

AV1 hardware decoding

Modem & Connectivity:

3GPP Rel. 17-compliant 5G modem

9.6Gbps (FR1) / 12.1Gbps (FR2)

Non-Terrestrial Network (NTN) support for satellite messaging

Wi-Fi 7 and Bluetooth 5.4

Improved GNSS analog interface for accurate positioning

Storage:

Supports UFS 4.0 for ultra-fast read/write speeds

What’s Next?

The Galaxy Z Flip7 is expected to be the first device to showcase the Exynos 2500 in action. Meanwhile, a Galaxy Z Flip7 FE model may launch with the older Exynos 2400 to offer a lower price point.

Samsung has clearly closed the gap with TSMC’s 3nm N3E used in rival chipsets like the Dimensity 9400 — and this release sets the stage for a new era of AI-centric, foldable-ready SoCs.